MC33FS4500NAE
| Parameters | |
|---|---|
| Factory Lead Time | 16 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS4500NAE Overview
The way of Tray is acceptable for shipping the power management.In order to facilitate transportation, it is packaged the power management in 48-LQFP Exposed Pad .Surface Mount is a universal mounting method for easy adaptation.There are a number of applications targeted at System Basis Chip .It is recommended that the operating temperature of the power management ic be set to -40°C~125°C to prevent malfunctions.It works with 1V~5V voltage.
MC33FS4500NAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS4500NAE Applications
There are a lot of NXP USA Inc. MC33FS4500NAEPower Management applications.
- Chromebook
- FPGA, DSP Core Power
- Industrial Telemetry Applications
- Isolated DC-DC Modules
- LP2996A: DDR3
- Set-Top-Box
- Networking Equipment
- Radar
- System Thermal for Servers
- I/Os (FPGAs, ASICs, DSPs)