MC32PF1550A3EP
| Parameters | |
|---|---|
| Factory Lead Time | 14 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 40-VFQFN Exposed Pad |
| Operating Temperature | -40°C~85°C |
| Packaging | Tray |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices |
| Voltage - Supply | 3.8V~7V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Analog IC - Other Type | POWER SUPPLY MANAGEMENT CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC32PF1550A3EP Overview
It is acceptable to ship in the direction of Tray .A convenient transport package is provided in 40-VFQFN Exposed Pad .The Surface Mount mounting method allows for easy adaptation.Applications targeting this power management include Embedded Systems, Low-Power IoT, Mobile/Wearable Devices and others.A temperature setting of -40°C~85°C is recommended to avoid malfunctions.The power management runs on 3.8V~7V voltage.It has been praised for its accuracy as a POWER SUPPLY MANAGEMENT CIRCUIT analog IC.
MC32PF1550A3EP Features
Mainly used in Embedded Systems, Low-Power IoT, Mobile/Wearable Devices applications
Operating temperature: -40°C~85°C
POWER SUPPLY MANAGEMENT CIRCUIT analog IC
MC32PF1550A3EP Applications
There are a lot of NXP USA Inc. MC32PF1550A3EPPower Management applications.
- DDR Termination Voltage WHITE SPACE
- Modules With Remote-Sense Capability
- Camera Power Applications
- SSTL-2 WHITE SPACE
- Automotive cluster
- Automotive head unit
- Industrial PC
- Automotive display
- Port/cable dongles
- HSTL Termination