| Parameters | |
|---|---|
| Factory Lead Time | 4 Weeks |
| Mount | Chassis Mount, Through Hole |
| Mounting Type | Chassis Mount |
| Package / Case | Twin Tower |
| Diode Element Material | SILICON |
| Packaging | Bulk |
| Published | 2012 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 2 |
| Termination | Solder |
| ECCN Code | EAR99 |
| Max Operating Temperature | 175°C |
| Min Operating Temperature | -40°C |
| Pitch | 4.2mm |
| Terminal Position | UPPER |
| Orientation | Straight |
| Terminal Form | UNSPECIFIED |
| JESD-30 Code | R-PUFM-X2 |
| Number of Contacts | 8 |
| Number of Elements | 2 |
| Element Configuration | Common Cathode |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) |
| Diode Type | Schottky |
| Current - Reverse Leakage @ Vr | 8mA @ 20V |
| Voltage - Forward (Vf) (Max) @ If | 650mV @ 150A |
| Max Voltage Rating (DC) | 600.6kV |
| Forward Current | 300A |
| Max Reverse Leakage Current | 1μA |
| Max Surge Current | 2.5kA |
| Output Current-Max | 150A |
| Application | POWER |
| Current - Average Rectified (Io) | 300A DC |
| Max Reverse Voltage (DC) | 40V |
| Average Rectified Current | 300A |
| Number of Phases | 1 |
| Peak Reverse Current | 1A |
| Max Repetitive Reverse Voltage (Vrrm) | 40V |
| Diode Configuration | 1 Pair Common Cathode |
| RoHS Status | RoHS Compliant |