| Parameters | |
|---|---|
| Factory Lead Time | 14 Weeks |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 2-XFDFN, FCDFN |
| Diode Element Material | GALLIUM ARSENIDE |
| Operating Temperature | -40°C~125°C TJ |
| Packaging | Tray |
| Published | 2013 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 2 |
| Termination | Solder |
| ECCN Code | EAR99 |
| Additional Feature | HIGH Q |
| Capacitance | 350FF |
| Terminal Position | BOTTOM |
| Terminal Form | NO LEAD |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-XBCC-N2 |
| Number of Elements | 1 |
| Power Dissipation-Max | 0.1W |
| Diode Type | Single |
| Capacitance @ Vr, F | 0.2pF @ 10V 1MHz |
| Reverse Current-Max | 0.1μA |
| Voltage - Peak Reverse (Max) | 20V |
| Breakdown Voltage-Min | 20V |
| Reverse Voltage (DC) | 14V |
| Diode Capacitance-Nom | 0.35pF |
| Diode Cap Tolerance | 14.2% |
| Q @ Vr, F | 3000 @ 4V, 50MHz |
| RoHS Status | ROHS3 Compliant |