M2S060T-FCSG325I
| Parameters | |
|---|---|
| Factory Lead Time | 10 Weeks |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 325-TFBGA, CSPBGA |
| Supplier Device Package | 325-CSPBGA (11x11) |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Series | SmartFusion®2 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of I/O | 200 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Primary Attributes | FPGA - 60K Logic Modules |
| Flash Size | 256KB |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
This SoC is built on ARM? Cortex?-M3 core processor(s).
This SoC is built on ARM? Cortex?-M3 core processor(s).It has been assigned a package 325-TFBGA, CSPBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.The SoC design uses MCU, FPGA architecture for its internal architecture.It is a member of the SmartFusion?2 series.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.This SoC security combines FPGA - 60K Logic Modules and that is something to note.A state-of-the-art Tray package houses this SoC system on a chip.In total, this SoC part has 200 I/Os.As for its flash size, it is 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060T-FCSG325I System On Chip (SoC) applications.
- ARM Cortex M4 microcontroller
- Central inverter
- Keywords
- Optical drive
- Medical Pressure
- Apple smart watch
- Self-aware system-on-chip (SoC)
- Personal Computers
- External USB hard disk/SSD
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