| Parameters | 
                                                                                                            
                                            | Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) | 
                                                                            
                                            | Package / Case | 256-LBGA | 
                                                                            
                                            | Operating Temperature | -40°C~125°C TJ | 
                                                                            
                                            | Packaging | Tray | 
                                                                            
                                            | Series | Automotive, AEC-Q100, SmartFusion®2 | 
                                                                            
                                            | Pbfree Code | yes | 
                                                                            
                                            | Part Status | Active | 
                                                                            
                                            | Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 
                                                                            
                                            | Peak Reflow Temperature (Cel) | NOT SPECIFIED | 
                                                                            
                                            | Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | 
                                                                            
                                            | Number of I/O | 138 | 
                                                                            
                                            | Speed | 166MHz | 
                                                                            
                                            | RAM Size | 64KB | 
                                                                            
                                            | Core Processor | ARM® Cortex®-M3 | 
                                                                            
                                            | Peripherals | DDR, PCIe, SERDES | 
                                                                            
                                            | Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 
                                                                            
                                            | Architecture | MCU, FPGA | 
                                                                            
                                            | Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | 
                                                                            
                                            | Primary Attributes | FPGA - 25K Logic Modules | 
                                                                            
                                            | Flash Size | 256KB | 
                                                                            
                                            | RoHS Status | RoHS Compliant | 
                                                                            
                                            | Factory Lead Time | 10 Weeks | 
                                                                                                    
                            
                         
                                                This SoC is built on ARM? Cortex?-M3 core processor(s).
There are ARM? Cortex?-M3 core processors in this SoC.It has been assigned a package 256-LBGA by its manufacturer for this system on a chip.A 64KB RAM SoC chip provides reliable performance to users.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.The system on a chip is part of the series Automotive, AEC-Q100, SmartFusion?2.This SoC meaning should have an average operating temperature of -40°C~125°C TJ.A significant feature of this SoC security is the combination of FPGA - 25K Logic Modules.It is packaged in a state-of-the-art Tray package.138 I/Os in total are included in this SoC part.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.It has a 256KB flash.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation 
M2S025TS-1VFG256T2 System On Chip (SoC) applications. 
- Wireless sensor networks
- Test and Measurement
- Medical
- Servo drive control module
- System-on-chip (SoC)
- Communication network-on-Chip (cNoC)
- AC drive control module
- Keywords
- Sports 
- USB hard disk enclosure