| Parameters |
| Factory Lead Time |
12 Weeks |
| Lifecycle Status |
IN PRODUCTION (Last Updated: 1 month ago) |
| Package / Case |
256-LBGA |
| Operating Temperature |
-40°C~125°C TJ |
| Packaging |
Tray |
| Series |
Automotive, AEC-Q100, SmartFusion®2 |
| Pbfree Code |
yes |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
| Number of I/O |
161 |
| Speed |
166MHz |
| RAM Size |
64KB |
| Core Processor |
ARM® Cortex®-M3 |
| Peripherals |
DDR |
| Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture |
MCU, FPGA |
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes |
FPGA - 5K Logic Modules |
| Flash Size |
128KB |
| RoHS Status |
RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
This SoC is built on ARM? Cortex?-M3 core processor(s).According to the manufacturer, this system on a chip has a package of 256-LBGA.With 64KB RAM implemented, this SoC chip provides users with reliable performance.The SoC design uses MCU, FPGA architecture for its internal architecture.Automotive, AEC-Q100, SmartFusion?2 is the series in which this system on chip SoC falls under.Temperatures should be -40°C~125°C TJ on average for this SoC meaning.In addition, this SoC security combines FPGA - 5K Logic Modules.Housed in the state-of-art Tray package.Total I/Os on this SoC part are 161.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.A 128KB flash can be seen on it.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
128KB extended flash.
There are a lot of Microsemi Corporation
M2S005S-1VFG256T2 System On Chip (SoC) applications.
- Test and Measurement
- Multiprocessor system-on-chips (MPSoCs)
- Industrial sectors
- ARM support modules
- Published Paper
- Robotics
- Apple smart watch
- Samsung galaxy gear
- POS Terminals
- Automotive gateway