LS1026AXE8Q1A
| Parameters | |
|---|---|
| Factory Lead Time | 18 Weeks |
| Package / Case | 780-FBGA, FCBGA |
| Operating Temperature | -40°C~105°C |
| Packaging | Tray |
| Published | 2016 |
| Series | QorIQ® Layerscape |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Speed | 1.6GHz |
| Core Processor | ARM® Cortex®-A72 |
| Ethernet | 10GbE (2), 2.5GbE (1), 1GbE (4) |
| Number of Cores/Bus Width | 2 Core 64-Bit |
| RAM Controllers | DDR4 |
| USB | USB 3.0 (3) + PHY |
| Security Features | Secure Boot, TrustZone® |
| SATA | SATA 6Gbps (1) |
| RoHS Status | ROHS3 Compliant |
LS1026AXE8Q1A Overview
With a packing size of 780-FBGA, FCBGA, this embedded microprocessor is ideal for international shipping. The packaging method Tray provides high reliability. This CPU has 2 Core 64-Bit cores and 2 Core 64-Bit bus widths. Identify the operating temperature around -40°C~105°C. From the QorIQ? Layerscape series. This CPU is cored with a ARM? Cortex?-A72 processor. A total of DDR4 RAM controllers are used by this CPU.
LS1026AXE8Q1A Features
ARM? Cortex?-A72 Core
LS1026AXE8Q1A Applications
There are a lot of NXP USA Inc. LS1026AXE8Q1A Microprocessor applications.
- Robotic prosthetic limbs
- Kindle
- Blenders
- Computer/laptop
- Keyboards
- Network application field
- Television
- Monitoring-temperature level, oil level, speed, distance, acceleration
- Gas monitoring systems
- Xbox