LS1026ASE8P1A
| Parameters | |
|---|---|
| Factory Lead Time | 18 Weeks |
| Package / Case | 780-FBGA, FCBGA |
| Operating Temperature | 0°C~105°C |
| Packaging | Tray |
| Published | 2016 |
| Series | QorIQ® Layerscape |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Speed | 1.4GHz |
| Core Processor | ARM® Cortex®-A72 |
| Ethernet | 10GbE (2), 2.5GbE (1), 1GbE (4) |
| Number of Cores/Bus Width | 2 Core 64-Bit |
| RAM Controllers | DDR4 |
| USB | USB 3.0 (3) + PHY |
| Security Features | Secure Boot, TrustZone® |
| SATA | SATA 6Gbps (1) |
| RoHS Status | ROHS3 Compliant |
LS1026ASE8P1A Overview
The embedded microprocessor has been packed in 780-FBGA, FCBGA for convenient overseas shipping. High reliability is achieved by using advanced packaging methods Tray. There are 2 Core 64-Bit cores/bus width on the CPU. Obtain a basic understanding of operating temperature around 0°C. This is part of the QorIQ? Layerscape series. This CPU is cored with a ARM? Cortex?-A72 processor. A CPU with this architecture uses DDR4 RAM controllers.
LS1026ASE8P1A Features
ARM? Cortex?-A72 Core
LS1026ASE8P1A Applications
There are a lot of NXP USA Inc. LS1026ASE8P1A Microprocessor applications.
- Hard drives
- Smartphones-calling, video calling, texting, email
- Accu-check
- Office automation equipment and computer peripherals
- Heater/Fan
- Fire alarms
- Hearing aids
- Dishwashers
- Set-top boxes
- Network communication, mobile communication field