KMPC859DSLZP66A
| Parameters | |
|---|---|
| Package / Case | 357-BBGA |
| Supplier Device Package | 357-PBGA (25x25) |
| Operating Temperature | 0°C~95°C TA |
| Packaging | Tray |
| Published | 2002 |
| Series | MPC8xx |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Base Part Number | MPC859 |
| Speed | 66MHz |
| Core Processor | MPC8xx |
| Voltage - I/O | 3.3V |
| Ethernet | 10Mbps (1), 10/100Mbps (1) |
| Number of Cores/Bus Width | 1 Core 32-Bit |
| Graphics Acceleration | No |
| RAM Controllers | DRAM |
| Additional Interfaces | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
| Co-Processors/DSP | Communications; CPM |
| RoHS Status | Non-RoHS Compliant |
KMPC859DSLZP66A Overview
The microprocessor is convenient for international shipping since it is packaged in 357-BBGA. Advanced packaging method Tray is used to provide high reliability. 1 Core 32-Bit cores/Bus width are present in the CPU. Understand how the operating temperature around 0°C~95°C TA is determined. This is a member of the MPC8xx series. MPC8xx is the processor core of this CPU. DRAM RAM controllers are used by this CPU. This microprocessor features I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interfaces to better serve its users. The CPU runs at 3.3V when it comes to I/O. You can search for variants of a microprocessor with MPC859. Suppliers offer a package of 357-PBGA (25x25).
KMPC859DSLZP66A Features
MPC8xx Core
KMPC859DSLZP66A Applications
There are a lot of NXP USA Inc. KMPC859DSLZP66A Microprocessor applications.
- Routers
- Laminators
- Industrial instrumentation devices
- DDC control
- Dryers
- Network application field
- Tape drives
- Walkie talkies
- Smartphone
- Answering machines