| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | TO-261-4, TO-261AA |
| Surface Mount | YES |
| Transistor Element Material | SILICON |
| Packaging | Cut Tape (CT) |
| Published | 1999 |
| Series | HEXFET® |
| JESD-609 Code | e3 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 4 |
| ECCN Code | EAR99 |
| Terminal Finish | Matte Tin (Sn) |
| Additional Feature | LOGIC LEVEL COMPATIBLE |
| Technology | MOSFET (Metal Oxide) |
| Terminal Position | DUAL |
| Terminal Form | GULL WING |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| JESD-30 Code | R-PDSO-G4 |
| Qualification Status | Not Qualified |
| Number of Elements | 1 |
| Configuration | SINGLE |
| Operating Mode | ENHANCEMENT MODE |
| Case Connection | DRAIN |
| FET Type | N-Channel |
| Rds On (Max) @ Id, Vgs | 40m Ω @ 3.8A, 10V |
| Vgs(th) (Max) @ Id | 2V @ 250μA |
| Input Capacitance (Ciss) (Max) @ Vds | 870pF @ 25V |
| Current - Continuous Drain (Id) @ 25°C | 3.8A Ta |
| Gate Charge (Qg) (Max) @ Vgs | 48nC @ 10V |
| Drain to Source Voltage (Vdss) | 55V |
| Drain Current-Max (Abs) (ID) | 5.2A |
| Drain-source On Resistance-Max | 0.051Ohm |
| Pulsed Drain Current-Max (IDM) | 30A |
| DS Breakdown Voltage-Min | 55V |
| Avalanche Energy Rating (Eas) | 110 mJ |
| RoHS Status | Non-RoHS Compliant |