| Parameters | |
|---|---|
| Factory Lead Time | 12 Weeks |
| Contact Plating | Tin |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 8-SOIC (0.154, 3.90mm Width) |
| Number of Pins | 8 |
| Transistor Element Material | SILICON |
| Operating Temperature | -55°C~150°C TJ |
| Packaging | Tape & Reel (TR) |
| Published | 2001 |
| Series | HEXFET® |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 8 |
| ECCN Code | EAR99 |
| Resistance | 50mOhm |
| Additional Feature | ULTRA LOW RESISTANCE |
| Subcategory | Other Transistors |
| Max Power Dissipation | 1.4W |
| Terminal Position | DUAL |
| Terminal Form | GULL WING |
| Current Rating | 4A |
| Base Part Number | IRF7309PBF |
| Number of Elements | 2 |
| Row Spacing | 6.3 mm |
| Operating Mode | ENHANCEMENT MODE |
| Power Dissipation | 1.4W |
| FET Type | N and P-Channel |
| Transistor Application | SWITCHING |
| Rds On (Max) @ Id, Vgs | 50m Ω @ 2.4A, 10V |
| Vgs(th) (Max) @ Id | 1V @ 250μA |
| Input Capacitance (Ciss) (Max) @ Vds | 520pF @ 15V |
| Current - Continuous Drain (Id) @ 25°C | 4A 3A |
| Gate Charge (Qg) (Max) @ Vgs | 25nC @ 4.5V |
| Polarity/Channel Type | N-CHANNEL AND P-CHANNEL |
| Turn-Off Delay Time | 25 ns |
| Continuous Drain Current (ID) | 4A |
| Threshold Voltage | 1V |
| Gate to Source Voltage (Vgs) | 20V |
| Drain Current-Max (Abs) (ID) | 4A |
| Drain to Source Breakdown Voltage | 30V |
| Pulsed Drain Current-Max (IDM) | 16A |
| FET Technology | METAL-OXIDE SEMICONDUCTOR |
| FET Feature | Standard |
| Nominal Vgs | 1 V |
| Height | 1.4986mm |
| Length | 4.9784mm |
| Width | 4.05mm |
| Radiation Hardening | No |
| REACH SVHC | No SVHC |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |