HSP50216KIZ
| Parameters | |
|---|---|
| Package / Case | 196-LFBGA |
| Surface Mount | YES |
| Packaging | Tray |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 196 |
| Terminal Finish | Matte Tin (Sn) |
| HTS Code | 8542.39.00.01 |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 0.8mm |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| JESD-30 Code | S-PBGA-B196 |
| Function | Downconverter |
| Qualification Status | Not Qualified |
| Operating Temperature (Max) | 85°C |
| Operating Temperature (Min) | -40°C |
| Temperature Grade | INDUSTRIAL |
| Telecom IC Type | BASEBAND CIRCUIT |
| RF Type | W-CDMA |
| Height Seated (Max) | 1.5mm |
| Length | 12mm |
| Width | 12mm |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 13 Weeks |
| Mounting Type | Surface Mount |
See Relate Datesheet