| Parameters | |
|---|---|
| Factory Lead Time | 6 Weeks |
| Mount | Chassis Mount |
| Mounting Type | Chassis Mount |
| Package / Case | TO-249AB |
| Diode Element Material | SILICON |
| Packaging | Bulk |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 3 |
| ECCN Code | EAR99 |
| HTS Code | 8541.10.00.80 |
| Terminal Position | SINGLE |
| Terminal Form | SOLDER LUG |
| JESD-30 Code | R-PSFM-D3 |
| Operating Temperature (Max) | 150°C |
| Number of Elements | 2 |
| Element Configuration | Common Cathode |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) |
| Diode Type | Schottky |
| Current - Reverse Leakage @ Vr | 1mA @ 35V |
| Voltage - Forward (Vf) (Max) @ If | 600mV @ 80A |
| Case Connection | ISOLATED |
| Operating Temperature - Junction | -55°C~150°C |
| Application | POWER |
| Max Reverse Voltage (DC) | 35V |
| Average Rectified Current | 80A |
| Number of Phases | 1 |
| Non-rep Pk Forward Current-Max | 1000A |
| Diode Configuration | 1 Pair Common Cathode |
| Reverse Current-Max | 1000μA |
| RoHS Status | RoHS Compliant |