| Parameters | |
|---|---|
| Factory Lead Time | 7 Weeks |
| Lifecycle Status | ACTIVE (Last Updated: 1 day ago) |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Package / Case | 27-PowerDIP Module (1.205, 30.60mm) |
| Weight | 13.32g |
| Published | 2016 |
| Series | Motion SPM® 3 |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 27 |
| ECCN Code | EAR99 |
| Type | IGBT |
| Terminal Finish | Tin (Sn) |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -40°C |
| HTS Code | 8541.29.00.95 |
| Max Power Dissipation | 69W |
| Terminal Position | DUAL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Number of Functions | 1 |
| Supply Voltage | 15V |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-XDMA-T27 |
| Voltage - Isolation | 2500Vrms |
| Configuration | 3 Phase |
| Voltage | 1.2kV |
| Current | 10A |
| Collector Emitter Voltage (VCEO) | 2.8V |
| Height Seated (Max) | 7.5mm |
| Length | 44mm |
| Width | 26.8mm |
| RoHS Status | ROHS3 Compliant |