Parameters | |
---|---|
Lead Free | Lead Free |
Factory Lead Time | 13 Weeks |
Lifecycle Status | ACTIVE (Last Updated: 4 days ago) |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-SOIC (0.154, 3.90mm Width) |
Number of Pins | 8 |
Weight | 230.4mg |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2002 |
Series | QFET® |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 8 |
ECCN Code | EAR99 |
Terminal Finish | Tin (Sn) |
Subcategory | Other Transistors |
Max Power Dissipation | 2W |
Terminal Position | DUAL |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Base Part Number | FQS4900 |
Qualification Status | Not Qualified |
Number of Elements | 2 |
Configuration | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 2W |
FET Type | N and P-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 550m Ω @ 650mA, 10V |
Vgs(th) (Max) @ Id | 1.95V @ 20mA |
Current - Continuous Drain (Id) @ 25°C | 1.3A 300mA |
Gate Charge (Qg) (Max) @ Vgs | 2.1nC @ 5V |
Rise Time | 25ns |
Drain to Source Voltage (Vdss) | 60V 300V |
Polarity/Channel Type | N-CHANNEL AND P-CHANNEL |
Fall Time (Typ) | 47 ns |
Turn-Off Delay Time | 35 ns |
Continuous Drain Current (ID) | 1.3A |
Gate to Source Voltage (Vgs) | 20V |
Drain-source On Resistance-Max | 0.65Ohm |
Drain to Source Breakdown Voltage | -300V |
Pulsed Drain Current-Max (IDM) | 5.2A |
FET Technology | METAL-OXIDE SEMICONDUCTOR |
FET Feature | Standard |
RoHS Status | ROHS3 Compliant |