| Parameters | |
|---|---|
| Factory Lead Time | 4 Weeks |
| Lifecycle Status | ACTIVE (Last Updated: 3 weeks ago) |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Package / Case | 20-PowerDIP Module (1.220, 31.00mm) |
| Weight | 5.70216g |
| Published | 2015 |
| Series | Motion SPM® 55 |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Type | IGBT |
| Terminal Finish | Tin (Sn) |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -40°C |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Voltage - Isolation | 1500Vrms |
| Configuration | 3 Phase Inverter |
| Voltage | 600V |
| Max Current Rating | 10A |
| Collector Emitter Voltage (VCEO) | 2.15V |
| RoHS Status | ROHS3 Compliant |