EMC08DRAI
| Parameters | |
|---|---|
| Factory Lead Time | 3 Weeks |
| Contact Material | Phosphor Bronze |
| Mount | Through Hole |
| Mounting Type | Through Hole, Right Angle |
| Material - Insulation | Polybutylene Terephthalate (PBT) |
| Operating Temperature | -65°C~125°C |
| Packaging | Tube |
| Published | 2016 |
| JESD-609 Code | e4 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Termination | Solder |
| ECCN Code | EAR99 |
| Connector Type | Full Bellows |
| Number of Positions | 16 |
| Color | Blue |
| Number of Rows | 2 |
| Gender | Female |
| Additional Feature | NONE |
| Subcategory | Headers and Edge Type Connectors |
| Contact Type | Full Bellows |
| Pitch | 0.100 2.54mm |
| Total Number of Contacts | 16 |
| Number of Conductors | ONE |
| Reference Standard | UL, CSA |
| Contact Finish | Gold |
| Reliability | COMMERCIAL |
| Body Length or Diameter | 1.675 inch |
| Number Of PCB Rows | 2 |
| PCB Contact Pattern | RECTANGULAR |
| Body Breadth | 0.33 inch |
| Body Depth | 0.631 inch |
| Rated Current (Signal) | 3A |
| Contact Resistance | 10mOhm |
| Card Type | Non Specified - Dual Edge |
| Read Out | Dual |
| Insulation Resistance | 5000000000Ohm |
| Number of Positions/Bay/Row | 8 |
| Flange Feature | Top Mount Opening, Threaded Insert, 4-40 |
| Body/Shell Style | RECEPTACLE |
| Dielectric Withstanding Voltage | 600VDC V |
| Contact Finish Thickness | 30.0μin 0.76μm |
| Plating Thickness | 30μin |
| Card Thickness | 0.062 1.57mm |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
EMC08DRAI Overview
Materials were packaged according to Tube's specs.There is a recommendation for mounting type Through Hole, Right Angle.The device is connected via the connector socket Full Bellows.In addition, this chip provides the following additional features: NONE
EMC08DRAI Features
EMC08DRAI Applications
There are a lot of Sullins Connector Solutions EMC08DRAI Edgeboard Connectors applications.
- Multiplexed Data Acquisition Systems
- Digital beam-forming systems for ultrasound
- Communication test equipment
- Imaging Systems
- Music reproduction technology
- High Speed Data Acquisition
- 3-phase power control
- Data Acquisition Systems
- Microcontrollers.
- In-building wireless telephony