DS21Q354C1+
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 256-BGA |
| Supplier Device Package | 256-BGA (27x27) |
| Packaging | Tray |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 3.3V |
| Function | Transceiver |
| Interface | E1 |
| Number of Circuits | 4 |
| RoHS Status | Non-RoHS Compliant |
DS21Q354C1+ Overview
The 256-BGA package reduces the amount of space on a board.For telecommunications equipment packing, the Tray method is used.The mounting type is Surface Mount.4 circuits are used in this telecom IC .3.3V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.
DS21Q354C1+ Features
Available in the 256-BGA package
DS21Q354C1+ Applications
There are a lot of Rochester Electronics, LLC DS21Q354C1+ Telecom applications.
- SONET/SDH terminal
- Cable Modem
- Short/Medium Loop
- ISDN NT1/TA
- Wireless Local Loop
- Digital Cross-Connect Systems
- PBX interfaces
- Interfaces to DS3
- Wireless local loop (WLL)
- DECT (Digital European Cordless Telephone) Base