| Parameters | |
|---|---|
| Factory Lead Time | 11 Weeks |
| Lifecycle Status | ACTIVE (Last Updated: 1 day ago) |
| Contact Plating | Tin |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Package / Case | 4-SIP, TS-6P |
| Weight | 7g |
| Operating Temperature | -55°C~150°C TJ |
| Packaging | Bulk |
| Published | 2016 |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| ECCN Code | EAR99 |
| HTS Code | 8541.10.00.80 |
| Technology | Standard |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Element Configuration | Single |
| Diode Type | Single Phase |
| Current - Reverse Leakage @ Vr | 10μA @ 1000V |
| Voltage - Forward (Vf) (Max) @ If | 1.1V @ 20A |
| Forward Current | 20A |
| Peak Reverse Current | 10μA |
| Max Repetitive Reverse Voltage (Vrrm) | 1kV |
| Max Forward Surge Current (Ifsm) | 250A |
| RoHS Status | ROHS3 Compliant |