| Parameters | |
|---|---|
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 196-LBGA |
| Number of Pins | 196 |
| Operating Temperature | 0°C~70°C |
| Packaging | Tray |
| Published | 2003 |
| Series | HOTlink II™ |
| JESD-609 Code | e1 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 5 (48 Hours) |
| Number of Terminations | 196 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Subcategory | Network Interfaces |
| Technology | BICMOS |
| Voltage - Supply | 3.135V~3.465V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 1mm |
| Reach Compliance Code | unknown |
| Time@Peak Reflow Temperature-Max (s) | 20 |
| Base Part Number | CY*15G02 |
| Function | Transceiver |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 3.3V |
| Interface | LVTTL |
| Number of Circuits | 2 |
| Nominal Supply Current | 700mA |
| Current - Supply | 570mA |
| Data Rate | 1500000 Mbps |
| Number of Transceivers | 2 |
| Height Seated (Max) | 1.5mm |
| Length | 15mm |
| Width | 15mm |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |