BMM150
| Parameters | |
|---|---|
| Factory Lead Time | 14 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 12-XFBGA, WLCSP |
| Surface Mount | YES |
| Operating Temperature | -40°C~85°C TA |
| Packaging | Tape & Reel (TR) |
| Published | 2012 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 12 |
| Technology | FlipCore, Hall Effect |
| Voltage - Supply | 1.62V~3.6V |
| Current - Supply (Max) | 20mA |
| Body Length or Diameter | 1.56mm |
| Body Breadth | 1.56 mm |
| Output Type | I2C, SPI |
| Operating Supply Voltage | 3.6V |
| Termination Type | SOLDER |
| Bandwidth | 10Hz |
| Resolution | 13 b |
| Linearity | 1 % |
| Sensing Method | Hall Effect |
| Sensing Range | ±1.3mT (X,Y), ±2.5mT (Z) |
| Ambient Temperature Range High | 85°C |
| Axis | X, Y, Z |
| Magnetic Field Range-Min | 1.2 mT |
| Magnetic Field Range-Max | 2.5 mT |
| Number of Axes | 3 |
| Height | 595μm |
| RoHS Status | ROHS3 Compliant |
See Relate Datesheet