BGC100GN6E6327XTSA1
| Parameters | |
|---|---|
| Factory Lead Time | 12 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 6-XFDFN |
| Surface Mount | YES |
| Packaging | Tape & Reel (TR) |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 6 |
| Terminal Finish | NOT SPECIFIED |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BUTT |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Number of Functions | 1 |
| Frequency | 600MHz~2.7GHz |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-XBCC-B6 |
| Telecom IC Type | RF AND BASEBAND CIRCUIT |
| RF Type | Cellular, CDMA, GSM, HSPA+, LTE, TD-SCDMA, W-CDMA |
| RoHS Status | ROHS3 Compliant |
See Relate Datesheet