BGA777N7E6327XTSA1
| Parameters | |
|---|---|
| Factory Lead Time | 4 Weeks |
| Contact Plating | Tin |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 6-XFDFN Exposed Pad |
| Number of Pins | 7 |
| Packaging | Tape & Reel (TR) |
| Published | 2013 |
| JESD-609 Code | e3 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 6 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -30°C |
| HTS Code | 8542.39.00.01 |
| Voltage - Supply | 2.6V~3V |
| Terminal Position | DUAL |
| Number of Functions | 1 |
| Supply Voltage | 2.8V |
| Terminal Pitch | 0.5mm |
| Frequency | 2.3GHz~2.7GHz |
| JESD-30 Code | R-PDSO-N6 |
| Temperature Grade | OTHER |
| Test Frequency | 2.3GHz~2.7MHz |
| Operating Supply Current | 4.2mA |
| Halogen Free | Halogen Free |
| Gain | 16dB |
| Telecom IC Type | RF AND BASEBAND CIRCUIT |
| RF Type | UMTS |
| Noise Figure | 1.2dB |
| Height Seated (Max) | 0.4mm |
| Length | 2mm |
| Width | 1.3mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
See Relate Datesheet