B0809J50ATI
| Parameters | |
|---|---|
| Factory Lead Time | 12 Weeks |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 0805 (2012 Metric) |
| Packaging | Tape & Reel (TR) |
| Published | 2010 |
| Series | Xinger® |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 6 |
| Termination | SMD/SMT |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -55°C |
| HTS Code | 8542.39.00.01 |
| Terminal Position | DUAL |
| Terminal Form | NO LEAD |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Number of Functions | 1 |
| Terminal Pitch | 0.65mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Pin Count | 6 |
| JESD-30 Code | R-XDMA-N6 |
| Qualification Status | Not Qualified |
| Case Code (Metric) | 2012 |
| Case Code (Imperial) | 0805 |
| Temperature Grade | OTHER |
| Impedance | 50Ohm |
| Frequency Range | 850MHz~915MHz |
| Telecom IC Type | TELECOM CIRCUIT |
| Insertion Loss (dB) | 0.5 dB |
| Insertion Loss (Max) | 0.6dB |
| Return Loss-Min | 15.3dB |
| Impedance - Unbalanced/Balanced | 50 / -Ohm |
| Height Seated (Max) | 0.75mm |
| Length | 2.04mm |
| Width | 1.29mm |
| RoHS Status | RoHS Compliant |
See Relate Datesheet