| Parameters | |
|---|---|
| Factory Lead Time | 36 Weeks |
| Mount | Chassis Mount, Screw |
| Mounting Type | Chassis Mount |
| Package / Case | SP1 |
| Number of Pins | 12 |
| Diode Element Material | SILICON |
| Operating Temperature | -40°C~150°C TJ |
| Packaging | Bulk |
| Published | 1997 |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 12 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Technology | Standard |
| Terminal Position | UPPER |
| Terminal Form | THROUGH-HOLE |
| Pin Count | 12 |
| Number of Elements | 1 |
| Element Configuration | Single |
| Diode Type | Three Phase |
| Current - Reverse Leakage @ Vr | 50μA @ 1600V |
| Voltage - Forward (Vf) (Max) @ If | 1.3V @ 90A |
| Case Connection | ISOLATED |
| Forward Current | 90A |
| Max Surge Current | 850A |
| Forward Voltage | 1.3V |
| Average Rectified Current | 90A |
| Number of Phases | 3 |
| Peak Reverse Current | 50μA |
| Max Repetitive Reverse Voltage (Vrrm) | 1.6kV |
| Peak Non-Repetitive Surge Current | 850A |
| Reverse Voltage (DC) | 1.6kV |
| Height | 11.5mm |
| Length | 51.6mm |
| Width | 40.8mm |
| Radiation Hardening | No |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |