 
    | Parameters | |
|---|---|
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | 
| Technology | Standard | 
| Terminal Position | UPPER | 
| Terminal Form | THROUGH-HOLE | 
| Pin Count | 12 | 
| Number of Elements | 6 | 
| Element Configuration | Single | 
| Diode Type | Three Phase | 
| Current - Reverse Leakage @ Vr | 20μA @ 1600V | 
| Voltage - Forward (Vf) (Max) @ If | 1.3V @ 40A | 
| Case Connection | ISOLATED | 
| Forward Current | 40A | 
| Forward Voltage | 1.3V | 
| Number of Phases | 3 | 
| Max Repetitive Reverse Voltage (Vrrm) | 1.6kV | 
| Peak Non-Repetitive Surge Current | 400A | 
| Radiation Hardening | No | 
| RoHS Status | RoHS Compliant | 
| Lead Free | Lead Free | 
| Factory Lead Time | 36 Weeks | 
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) | 
| Mount | Chassis Mount, Screw | 
| Mounting Type | Chassis Mount | 
| Package / Case | SP1 | 
| Number of Pins | 1 | 
| Diode Element Material | SILICON | 
| Operating Temperature | -40°C~150°C TJ | 
| Packaging | Bulk | 
| Published | 1997 | 
| JESD-609 Code | e1 | 
| Pbfree Code | yes | 
| Part Status | Active | 
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 
| Number of Terminations | 12 |