A2F060M3E-1FGG256M

This SoC is built on ARM? Cortex?-M3 core processor(s).

A ARM? Cortex?-M3 core processor(s) is built into this SoC.Manufacturer assigns package 256-LBGA to this system on a chip.The 16KB RAM implementation of this SoC chip ensures efficient performance for users.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.It is a member of the SmartFusion? series.In general, this SoC meaning should operate at a temperature of -55°C~125°C TJ on a regular basis.This SoC security combines ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops and that is something to note.Tray package houses this SoC system on a chip.MCU - 26, FPGA - 66 I/Os are available in this SoC part.This flash has a size of 128KB.You can get system on chips with similar specs and purposes by searching A2F060M3E.During operation, the wireless SoC runs at a frequency of 100MHz.This SoC meaning utilizes a core architecture of ARM as its foundation.The computer SoC has a pin count of 256.It is just enough to start the SoC computing at -55°C.125°C is the designing maximum operating temperature of this SoC system on chip.

ARM? Cortex?-M3 processor.

16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation

A2F060M3E-1FGG256M System On Chip (SoC) applications.

• ARM support modules
• Wireless sensor networks
• Remote control
• Temperature Sensors
• Medical
• Smart appliances
• Efficient hardware for training of neural networks
• Keyboard
• PC peripherals
• Cyberphysical system-on-chip