Parameters |
Factory Lead Time |
7 Weeks |
Contact Plating |
Tin |
Mount |
Surface Mount |
Package / Case |
TQFP |
Number of Pins |
64 |
Packaging |
Bulk |
Published |
2009 |
Part Status |
Active |
Max Operating Temperature |
70°C |
Min Operating Temperature |
0°C |
Operating Supply Voltage |
3.3V |
Max Supply Voltage |
3.6V |
Min Supply Voltage |
3V |
Element Configuration |
Dual |
Max Supply Current |
55mA |
Frequency (Max) |
100MHz |
Access Time |
6.5 ns |
Bus Directional |
Unidirectional |
Retransmit Capability |
Yes |
Length |
10mm |
Width |
10mm |
Thickness |
1.4mm |
RoHS Status |
RoHS Compliant |
Lead Free |
Lead Free |
72V261LA10TFG Overview
The TQFP package contains FIFO memory chip.There's a Bulk on the package.Mounting it in the Surface Mount way is recommended.There are 64 pins for operation.FIFO design requires a maximum current of 55mA to operate.A 3.3V supply voltage will ensure FIFO's maximum efficiency.The FIFO products must be run at a minimum temperature of 0°C degrees Celsius to ensure reliability.As a result of having a maximum operating temperature of 70°C degrees Celsius, the unit is capable of exhibiting stable operation.It is possible to operate the FIFO memory chip at very low supply voltages, such as 3V volts.FIFO memory can handle a maximum supply voltage of 3.6V V.Regular operation has a FIFO memory's maximum value of 100MHz .
72V261LA10TFG Features
Frequency at most
72V261LA10TFG Applications
There are a lot of Integrated Device Technology (IDT) 72V261LA10TFG FIFOs Memory applications.
- Communications Systems
- Programmable Logic Controller
- Network switching/routing
- Networking
- Controlled baseline
- Routers
- Medical Monitoring Device
- One assembly
- SPI Bus Flash Memory Device
- Character generators