72T7295L4-4BBG
| Parameters | |
|---|---|
| Factory Lead Time | 12 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 324-BGA |
| Supplier Device Package | 324-PBGA (19x19) |
| Operating Temperature | 0°C~70°C |
| Packaging | Tray |
| Series | 72T |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 2.375V~2.625V |
| Base Part Number | 72T7295 |
| Function | Asynchronous, Synchronous |
| Current - Supply (Max) | 130mA |
| Memory Size | 2.25M 32K x 72 |
| Access Time | 8ns, 3.4ns |
| Data Rate | 100MHz, 225MHz |
| Bus Directional | Uni-Directional |
| Retransmit Capability | Yes |
| FWFT Support | Yes |
| Programmable Flags Support | Yes |
| Expansion Type | Depth, Width |
| RoHS Status | ROHS3 Compliant |
72T7295L4-4BBG Overview
FIFO memory chip is contained in the 324-BGA package.It comes in a Tray package.There is a memory of 2.25M 32K x 72 available for storing data and applications.It is recommended that the temperature be kept at 0°C~70°C to ensure reliable operation.A mounting type of Surface Mount is associated with the FIFO memory.For operation, a voltage of 2.375V~2.625V is used.It is part of the 72T series of memory logics.This FIFO products can operate at a maximum operating supply current of 130mA .Memory IC is a member of the 72T7295 family.
72T7295L4-4BBG Features
2.25M 32K x 72 memory size
72T series
Best part number of 72T7295
72T7295L4-4BBG Applications
There are a lot of Renesas Electronics America Inc. 72T7295L4-4BBG FIFOs Memory applications.
- Down-Hole Energy Drilling
- Character generators
- Transistors
- Data communications
- PC peripheral
- Video
- Seismic Data Collection at Extreme Temperatures
- SPI Bus Flash Memory Device
- Multi-stage synchronizer
- Data-acquisition systems