72T72105L4-4BBG
| Parameters | |
|---|---|
| Factory Lead Time | 10 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 324-BGA |
| Operating Temperature | 0°C~70°C |
| Packaging | Tray |
| Series | 72T |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 2.375V~2.625V |
| Base Part Number | 72T72105 |
| Function | Asynchronous, Synchronous |
| Current - Supply (Max) | 130mA |
| Memory Size | 4.5M 64K x 72 |
| Access Time | 8ns, 3.4ns |
| Data Rate | 100MHz, 225MHz |
| Bus Directional | Uni-Directional |
| FWFT Support | Yes |
| Expansion Type | Depth, Width |
| RoHS Status | ROHS3 Compliant |
72T72105L4-4BBG Overview
You can find FIFO memory chip in package 324-BGA .It's packaged in the shape of a Tray .The FIFO chips have a memory of 4.5M 64K x 72 that can be used to store applications and data.It is recommended that the temperature be kept at 0°C~70°C to ensure reliable operation.A mounting type of Surface Mount is associated with the FIFO memory.A voltage supply of 2.375V~2.625V is needed to operate it.It is a member of the 72T series .There is a maximum operating current of 130mA in memory IC's supply.Memory IC is a member of the 72T72105 family.
72T72105L4-4BBG Features
4.5M 64K x 72 memory size
72T series
Best part number of 72T72105
72T72105L4-4BBG Applications
There are a lot of Renesas Electronics America Inc. 72T72105L4-4BBG FIFOs Memory applications.
- Consumer Systems
- Network bridges
- Emulators
- Thermal Management for DDR3 Memory Modules
- Data
- Analog-to-digital converters
- Fabrication Site
- PC peripheral
- Data-acquisition systems
- High-speed graphics pixel buffer