| Parameters | |
|---|---|
| Factory Lead Time | 7 Weeks |
| Contact Plating | Tin |
| Mount | Surface Mount |
| Package / Case | TO-263 |
| Material | Copper |
| Shape | Rectangular, Fins |
| Package Cooled | TO-263 (D2Pak) |
| Material Finish | Tin |
| Published | 2006 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Type | Top Mount |
| Color | Black |
| Depth | 19.38mm |
| Attachment Method | SMD Pad |
| Height Off Base (Height of Fin) | 0.450 11.43mm |
| Thermal Resistance @ Forced Air Flow | 3.00°C/W @ 300 LFM |
| Thermal Resistance @ Natural | 11.00°C/W |
| Power Dissipation @ Temperature Rise | 2.0W @ 30°C |
| Height | 11mm |
| Length | 0.763 19.38mm |
| Width | 1.000 25.40mm |
| Radiation Hardening | No |
| REACH SVHC | No SVHC |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |