7-530654-5
| Parameters | |
|---|---|
| Factory Lead Time | 13 Weeks |
| Lifecycle Status | ACTIVE (Last Updated: 5 months ago) |
| Contact Material | Phosphor Bronze |
| Contact Plating | Gold, Tin |
| Mount | Panel, Through Hole |
| Mounting Type | Panel Mount |
| Housing Material | Glass |
| Material - Insulation | Polyester, Glass Filled |
| PCB Mounting Orientation | Vertical |
| Underplate Material | Nickel |
| Operating Temperature | -55°C~105°C |
| Packaging | Bulk |
| Published | 2008 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder Eyelet(s) |
| Connector Type | Connector, Receptacle, Socket |
| Number of Positions | 36 |
| Max Operating Temperature | 105°C |
| Min Operating Temperature | -55°C |
| Color | Green |
| Number of Rows | 2 |
| Gender | Female |
| Pitch | 0.156 3.96mm |
| Orientation | Vertical |
| Current Rating | 5A |
| Contact Finish | Gold |
| Number of Contacts | 18 |
| Housing Color | Green |
| Lead Length | 7.11mm |
| Card Type | Non Specified - Dual Edge |
| Read Out | Dual |
| Row Spacing | 5.97 mm |
| Flange Feature | Flush Mount, Top Opening, Unthreaded, 0.128 (3.25mm) Dia |
| ELV | Compliant |
| Max Voltage Rating (AC) | 600V |
| Contact Current Rating | 5A |
| Height | 11.68mm |
| Contact Finish Thickness | 30.0μin 0.76μm |
| Plating Thickness | 760 nm |
| Card Thickness | 0.055 ~ 0.070 1.40mm ~ 1.78mm |
| RoHS Status | RoHS Compliant |
7-530654-5 Overview
As per Bulk's specifications, the material was packaged.The mount type Panel Mount is recommended.Connection to the device is made through the connector socket Connector, Receptacle, Socket.It's stable at 105°C°C.It must be operated at a minimum temperature of -55°C degrees Celsius in order to operate reliably.
7-530654-5 Features
7-530654-5 Applications
There are a lot of TE Connectivity AMP Connectors 7-530654-5 Edgeboard Connectors applications.
- Communication test equipment
- Microcontrollers.
- Scientific instruments
- Digital Storage Oscilloscope
- Telecommunications
- RADAR processing, digital oscilloscopes
- Spectrum Analysis
- 4-channel data acquisition
- CMOS Image sensors for mobile applications
- Cell Phones