67SLH050050030PI00
| Parameters | |
|---|---|
| Factory Lead Time | 4 Weeks |
| Material | Polyurethane Foam, Tin-Copper Polyester (SN/CU) |
| Shape | Hourglass |
| Operating Temperature | -40°C~70°C |
| Packaging | Tape & Reel (TR) |
| Published | 2015 |
| Series | SMD Grounding Metallized |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Type | Film Over Foam |
| Max Operating Temperature | 158°C |
| Min Operating Temperature | -40°C |
| Attachment Method | Solder |
| Height | 0.197 5.00mm |
| Length | 0.118 3.00mm |
| Width | 0.197 5.00mm |
| Thickness | 5.0038mm |
| RoHS Status | RoHS Compliant |
See Relate Datesheet