67SLH050050025PI00
| Parameters | |
|---|---|
| Factory Lead Time | 4 Weeks |
| Material | Polyurethane Foam, Tin-Copper Polyester (SN/CU) |
| Shape | Hourglass |
| Operating Temperature | -40°C~70°C |
| Packaging | Tape & Reel (TR) |
| Published | 2015 |
| Series | SMD Grounding Metallized |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Type | Film Over Foam |
| Max Operating Temperature | 158°C |
| Min Operating Temperature | -40°C |
| Attachment Method | Solder |
| Height | 0.197 5.00mm |
| Length | 0.098 2.50mm |
| Width | 0.197 5.00mm |
| Thickness | 5.0038mm |
| RoHS Status | RoHS Compliant |
67SLH050050025PI00 Overview
There are materials in the Contact RFI package from Polyurethane Foam, Tin-Copper Polyester (SN/CU).EMI/RFIs capable of operating at -40°C~70°C can be used.High reliability is provided by the advanced RFI and EMI contact' packaging Tape & Reel (TR).At158°C, contacter RFI should run.Film Over Foam Type from the contacter RFI.As you may know, this RFI EMI comes from the well-known SMD Grounding Metallized series product line.
67SLH050050025PI00 Features
Film Over Foam
Tape & Reel (TR) is used
SMD Grounding Metallized series
67SLH050050025PI00 Applications
There are a lot of Laird Technologies EMI 67SLH050050025PI00 RFI and EMI Contacts applications.
- Medical
- LED Lighting
- Low Noise Amplifier
- Internet of Things
- Fitness
- Health care
- Digital Remote
- Health and Fitness
- Power management
- Home and Security