67SLG040035030PI00
| Parameters | |
|---|---|
| Factory Lead Time | 4 Weeks |
| Material | Polyurethane Foam, Tin-Copper Polyester (SN/CU) |
| Shape | Rectangle |
| Operating Temperature | -40°C~70°C |
| Packaging | Tape & Reel (TR) |
| Published | 2015 |
| Series | SMD Grounding Metallized |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Type | Film Over Foam |
| Max Operating Temperature | 158°C |
| Min Operating Temperature | -40°C |
| Attachment Method | Solder |
| Height | 0.138 3.50mm |
| Length | 0.118 3.00mm |
| Width | 0.157 4.00mm |
| Thickness | 3.5052mm |
| RoHS Status | RoHS Compliant |
67SLG040035030PI00 Overview
The Contact RFI contains materials from Polyurethane Foam, Tin-Copper Polyester (SN/CU).The EMI/RFI can work at -40°C~70°C.The RFI and EMI contact' packaging Tape & Reel (TR) provides high reliability.At a temperature around 158°C degrees Celsius, contacter RFI should be running.Film Over Foam contacter RFI type.RFI EMIs from the well-known SMD Grounding Metallized series product line are featured in this RFI EMI.
67SLG040035030PI00 Features
Film Over Foam
Tape & Reel (TR) is used
SMD Grounding Metallized series
67SLG040035030PI00 Applications
There are a lot of Laird Technologies EMI 67SLG040035030PI00 RFI and EMI Contacts applications.
- Thermostats
- Secure Payment
- Fitness
- Home and Security
- Smart Meters
- Industrial Logger
- LoT applications
- Low Noise Amplifier
- LED Lighting