658-25ABT1E

658-25ABT1E

HEATSINK CPU 28MM SQ BLK W/TAPE


  • Manufacturer: Wakefield-Vette
  • Origchip NO: 869-658-25ABT1E
  • Package: -
  • Datasheet: -
  • Stock: 216
  • Description: HEATSINK CPU 28MM SQ BLK W/TAPE (Kg)

Details

Tags

Parameters
Factory Lead Time 12 Weeks
Mount Adhesive
Material Aluminum
Weight 5.67g
Shape Square, Pin Fins
Package Cooled BGA
Material Finish Black Anodized
Published 2008
Series 658
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Top Mount
Construction FIN
Attachment Method Thermal Tape, Adhesive (Included)
Height Off Base (Height of Fin) 0.250 6.35mm
Thermal Resistance @ Forced Air Flow 5.00°C/W @ 500 LFM
Natural Thermal Resistance 5 °C/W
Profile PIN FIN ARRAY
Power Dissipation @ Temperature Rise 2.0W @ 40°C
Fin Orientation OMNIDIRECT
Length 1.100 27.94mm
Width 1.100 27.94mm
RoHS Status ROHS3 Compliant
Lead Free Lead Free
See Relate Datesheet

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