532824-1
| Parameters | |
|---|---|
| Factory Lead Time | 12 Weeks |
| Lifecycle Status | ACTIVE (Last Updated: 5 months ago) |
| Contact Plating | Gold |
| Mount | Through Hole |
| Material | COPPER ALLOY |
| Packaging | Bulk |
| Published | 1997 |
| Series | HDI (High Density Interconnect) |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Through Hole |
| ECCN Code | EAR99 |
| Type | Power |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -65°C |
| Gender | Male |
| HTS Code | 8536.90.40.00 |
| MIL Conformance | NO |
| DIN Conformance | NO |
| IEC Conformance | NO |
| Pitch | 2.54mm |
| Orientation | Vertical |
| Shielding | Unshielded |
| Depth | 5.08mm |
| Row Spacing | 4.994758 mm |
| ELV | Compliant |
| Contact Current Rating | 3A |
| Contact Termination | Solder, PCB |
| Rated Current | 3A |
| Pin or Socket | Pin |
| Assembly Item Name | CONTACT |
| Make First / Break Last | No |
| Height | 5.08mm |
| Length | 16.68mm |
| Contact Finish Thickness | 30.0μin 0.76μm |
| RoHS Status | RoHS Compliant |
See Relate Datesheet