374324B60023G
| Parameters | |
|---|---|
| Factory Lead Time | 8 Weeks |
| Mount | Solder |
| Package / Case | BGA |
| Material | Aluminum |
| Shape | Square, Pin Fins |
| Package Cooled | BGA, FPGA |
| Material Finish | Black Anodized |
| Published | 2002 |
| Series | 37432 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Type | Board Level |
| Color | Silver |
| Depth | 27mm |
| Attachment Method | Solder Anchor |
| Height Off Base (Height of Fin) | 0.394 10.00mm |
| Thermal Resistance @ Forced Air Flow | 6.00°C/W @ 500 LFM |
| Thermal Resistance @ Natural | 30.60°C/W |
| Power Dissipation @ Temperature Rise | 1.5W @ 50°C |
| Height | 10mm |
| Length | 1.063 27.00mm |
| Width | 1.063 27.00mm |
| Radiation Hardening | No |
| REACH SVHC | No SVHC |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
See Relate Datesheet