2327677-1
| Parameters | |
|---|---|
| Factory Lead Time | 12 Weeks |
| Contact Material | Copper Alloy |
| Mounting Type | Surface Mount |
| Material - Insulation | Liquid Crystal Polymer (LCP) |
| Operating Temperature | -55°C~85°C |
| Packaging | Tape & Reel (TR) |
| Series | Sliver 2.0 |
| Feature | Board Guide, Pick and Place, Solder Retention |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Termination | Solder |
| Number of Positions | 140 |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Pitch | 0.024 0.60mm |
| Contact Finish | Gold |
| Card Type | Non Specified - Dual Edge |
| Read Out | Dual |
| Number of Positions/Bay/Row | 28; 14; 28 |
| Contact Finish Thickness | Flash |
| Card Thickness | 0.062 1.57mm |
| RoHS Status | RoHS Compliant |
2327677-1 Overview
It was packaged based on Tape & Reel (TR)'s specs.Type Surface Mount is recommended.A device with Board Guide, Pick and Place, Solder Retention features is available.Sliver 2.0 indicates the device's series number.
2327677-1 Features
Sliver 2.0 series
2327677-1 Applications
There are a lot of TE Connectivity AMP Connectors 2327677-1 Edgeboard Connectors applications.
- High Speed Data Acquisition for PCs
- Music reproduction technology
- Scientific instruments.
- Displaying
- Audio/Video devices
- Medical Instrumentation and medical imaging
- Rotary encoder
- Wireless and wired broadband communications
- Digital Multimeters, PLC's (Programming Logic Controllers)
- 3-phase power control