| Parameters | |
|---|---|
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Housing Material | Liquid Crystal Polymer (LCP) |
| Number of Positions or Pins (Grid) | 370 (19 x 19) |
| Contact Material - Mating | Copper Alloy |
| Contact Material - Post | Copper Alloy |
| Packaging | Tray |
| JESD-609 Code | e3 |
| Feature | Open Frame |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| ECCN Code | EAR99 |
| Type | PGA, ZIF (ZIP) |
| Additional Feature | LOW PROFILE |
| HTS Code | 8536.69.40.40 |
| Contact Finish - Mating | Gold |
| Orientation | Straight |
| Pitch - Mating | 0.100 2.54mm |
| Number of Contacts | 370 |
| Housing Color | Natural |
| Insulation Resistance | 5GOhm |
| ELV | Compliant |
| Termination Post Length | 0.093 2.36mm |
| Pitch - Post | 0.100 2.54mm |
| Contact Finish Thickness - Mating | 30.0μin 0.76μm |
| Contact Finish Thickness - Post | 30.0μin 0.76μm |
| Material Flammability Rating | UL94 V-0 |
| RoHS Status | RoHS Compliant |
| Flammability Rating | UL94 V-0 |