1N6312US
| Parameters | |
|---|---|
| Factory Lead Time | 7 Weeks |
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
| Contact Plating | Lead, Tin |
| Mount | Surface Mount |
| Package / Case | MELF |
| Number of Pins | 2 |
| Diode Element Material | SILICON |
| Published | 1999 |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Active |
| Number of Terminations | 2 |
| ECCN Code | EAR99 |
| Terminal Finish | TIN LEAD |
| Max Operating Temperature | 175°C |
| Min Operating Temperature | -65°C |
| Additional Feature | METALLURGICALLY BONDED, HIGH RELIABILITY |
| HTS Code | 8541.10.00.50 |
| Subcategory | Voltage Reference Diodes |
| Max Power Dissipation | 500mW |
| Technology | ZENER |
| Terminal Position | END |
| Terminal Form | WRAP AROUND |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Pin Count | 2 |
| Qualification Status | Not Qualified |
| Number of Elements | 1 |
| Polarity | UNIDIRECTIONAL |
| Element Configuration | Single |
| Diode Type | ZENER DIODE |
| Power Dissipation | 500mW |
| Case Connection | ISOLATED |
| Test Current | 20mA |
| Reference Voltage | 3.3V |
| Zener Voltage | 3.3V |
| Voltage Tol-Max | 5% |
| Voltage Tolerance | 5% |
| Radiation Hardening | Yes |
| RoHS Status | Non-RoHS Compliant |
See Relate Datesheet