| Parameters | |
|---|---|
| Contact Material | Copper |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Housing Material | Aluminum Alloy |
| Number of Positions or Pins (Grid) | 6 (2 x 3) |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Operating Temperature | -55°C~125°C |
| Published | 2005 |
| Series | 700 |
| JESD-609 Code | e0 |
| Feature | Carrier, Closed Frame |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| ECCN Code | EAR99 |
| Type | DIP, 0.3 (7.62mm) Row Spacing |
| Number of Rows | 2 |
| Additional Feature | STANDARD PROFILE, VERTICAL MOUNT, DIP SOCKET |
| Contact Finish - Mating | Gold |
| Current Rating (Amps) | 3A |
| Orientation | Straight |
| Reach Compliance Code | unknown |
| Pitch - Mating | 0.100 2.54mm |
| Number of Contacts | 6 |
| Contact Resistance | 10mOhm |
| Termination Post Length | 0.125 3.18mm |
| Pitch - Post | 0.100 2.54mm |
| Height | 4.2mm |
| Length | 7.62mm |
| Width | 7.62mm |
| Contact Finish Thickness - Mating | 20.0μin 0.51μm |
| Contact Finish Thickness - Post | 20.0μin 0.51μm |
| Material Flammability Rating | UL94 V-0 |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |