10018783-12012TLF
| Parameters | |
|---|---|
| Factory Lead Time | 11 Weeks |
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Housing Material | Nylon |
| Material - Insulation | Polyamide (PA), Nylon, Glass Filled |
| Operating Temperature | -55°C~85°C |
| Packaging | Tray |
| Series | HPCE® |
| Feature | Board Guide, Locking Ramp |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder, Staggered |
| Connector Type | Cantilever |
| Number of Positions | 98 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -55°C |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Contact Type | Cantilever |
| Pitch | 0.039 1.00mm |
| Orientation | Straight |
| Current Rating | 1.1A |
| Contact Finish | Gold |
| Voltage - Rated AC | 300V |
| Number of Contacts | 98 |
| Housing Color | Black |
| Card Type | PCI Express™ |
| Read Out | Dual |
| Insulation Resistance | 1GOhm |
| Max Voltage Rating (AC) | 300V |
| Length | 56mm |
| Width | 7.4mm |
| Contact Finish Thickness | 30.0μin 0.76μm |
| Card Thickness | 0.062 1.57mm |
| Board Thickness | 2.36mm |
| RoHS Status | RoHS Compliant |
| Flammability Rating | UL94 V-0 |
| Lead Free | Lead Free |
10018783-12012TLF Overview
Tray wanted the material packaged as per his specs.It is recommended to mount the device using mounting type Through Hole.The device is connected using the connector socket Cantilever.Features: Board Guide, Locking Ramp.It is indicated by the HPCE? that the device belongs to a certain series.The maximum operating temperature is 85°C°C for stability.This device's reliability depends on a minimum working temperature of -55°C degrees Celsius.
10018783-12012TLF Features
HPCE? series
10018783-12012TLF Applications
There are a lot of Amphenol ICC (FCI) 10018783-12012TLF Edgeboard Connectors applications.
- Uninterrupted Power Supplies
- CMOS Image sensors for mobile applications
- Digital beam-forming systems for ultrasound
- Scientific instruments
- Microcontrollers.
- Wireless and wired broadband communications
- AC motor control
- TD-SCDMA, WiMAX
- Handheld Terminal Interface
- High Speed Data Acquisition for PCs