| Parameters | |
|---|---|
| Contact Material | Copper |
| Contact Plating | Gold |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Number of Pins | 40 |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Number of Positions or Pins (Grid) | 40 (2 x 20) |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Brass |
| Operating Temperature | -65°C~125°C |
| Packaging | Bulk |
| Published | 2012 |
| Series | 100 |
| Feature | Open Frame |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| Type | DIP, 0.6 (15.24mm) Row Spacing |
| Number of Positions | 40 |
| Contact Finish - Mating | Gold |
| Current Rating (Amps) | 1A |
| Pitch | 2.54mm |
| Pitch - Mating | 0.100 2.54mm |
| Number of Contacts | 40 |
| Contact Finish - Post | Gold |
| Termination Post Length | 0.126 3.20mm |
| Pitch - Post | 0.100 2.54mm |
| Height | 4.1mm |
| Length | 50.8mm |
| Width | 17.8mm |
| Contact Finish Thickness - Mating | 8.00μin 0.203μm |
| Contact Finish Thickness - Post | Flash |
| Material Flammability Rating | UL94 V-0 |
| RoHS Status | Non-RoHS Compliant |