1-1871058-3
| Parameters | |
|---|---|
| Factory Lead Time | 21 Weeks |
| Lifecycle Status | ACTIVE (Last Updated: 3 days ago) |
| Contact Material | Copper Alloy |
| Contact Plating | Tin, Gold |
| Mount | Press Fit, Through Hole |
| Mounting Type | Through Hole |
| Housing Material | Thermoplastic |
| Weight | 2.863g |
| Material - Insulation | Thermoplastic |
| PCB Mounting Orientation | Vertical |
| Operating Temperature | -55°C~85°C |
| Packaging | Bulk |
| Published | 2010 |
| Feature | Board Guide, Locking Ramp |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Press-Fit |
| Number of Positions | 98 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Pitch | 0.039 1.00mm |
| Orientation | Vertical |
| Current Rating | 1.1A |
| Contact Finish | Gold or Gold-Palladium |
| Number of Contacts | 98 |
| Housing Color | Black |
| Lead Length | 3.2512mm |
| Operating Supply Voltage | 50V |
| Card Type | PCI Express™ |
| Read Out | Dual |
| ELV | Compliant |
| Circuit Application | Signal |
| Termination Post Length | 3.25mm |
| Height | 10.9982mm |
| Length | 56.007mm |
| Width | 8.88mm |
| Contact Finish Thickness | 30.0μin 0.76μm |
| Plating Thickness | 500 nm |
| Card Thickness | 0.062 1.57mm |
| PCB Thickness | 1.5748mm |
| RoHS Status | RoHS Compliant |
| Lead Free | Not Applicable |
1-1871058-3 Overview
Packaging was done to Bulk's specifications.Recommended mounting type is Through Hole.This device has Board Guide, Locking Ramp features.Operating temperatures of 85°C°C provide stable performance.For it to function properly, it must be maintained at a temperature of -40°C degrees Celsius at all times.
1-1871058-3 Features
1-1871058-3 Applications
There are a lot of TE Connectivity AMP Connectors 1-1871058-3 Edgeboard Connectors applications.
- Medical Imaging
- 3-phase power control
- Automotive
- Uninterrupted Power Supplies
- Microcontrollers.
- In-building wireless telephony
- Multiplexed Data Acquisition Systems
- Displaying
- Digital beam-forming systems for ultrasound
- Wireless and wired broadband communications